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EDTP
PostTime:2012/5/7 14:04:26    hit:2029
 

EDTP (N,N,N,'N'-tetrakis(2-hydropropyl)ethylene diamine)

 

CAS No.: 102-60-3

 

Other Name:

Ethylenediamine-N,N,N',N'-tetra-2-propanol

 

Molecular Formula:

C14H32N2O4

 

Molecular Weight:

 

Characteristic:

Appearance

Clear colorless liquid

Assay(%)

75

Density g/cm3(20)

1.04-1.06

pH

8.5-9.5

Refractive inde (20)

1.4470-1.4570

Level of addition(mg/L)

10-30

 

Main Application:

It is solubled in water easily, its aqueous solution is weak alkaline, primarily used as complexing agent for chemical copper plating.

 
 
Lithium-ion Battery Additives
 
· Lithium-ion Battery Additives
Electroplating Intermediates
 
· Nickel Plating
· Zinc Plating
· Copper Plating
· Special Fine Chemicals
· Fluorine surfactants
Electroplating Additives
 
· Electroplating Additives Decorative Plating Process
· Electroplating Additives Anticorrosion Plating Process
Raw Materials
 
· Raw Materials
Machines & Materials
 
· Machines & Materials

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