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FF-210 Acidic Bright Copper Plating Process
PostTime:2012/5/21 13:55:59    hit:1583
 

FF-210 Acidic Bright Copper Plating Process

 

PROPERTIES & APPLICATION:

1.   Rapid depositing rate and bright plating, extremely high leveling and brightness.

2.   A mirror bright deposit can be obtained in the wide range of current density, as well as extremely high leveling brightness at low current density region.

3.   Wide range of working temperature, good effect can be obtained at 10-35.

4.   High impurity tolerance. It is not easy to produce pinholes, pits and white haze on deposit.

5.   Operate easily, low brightener consumption.

6.   The brightener has high stability and good compatibility. It can mix with any brightener, and change bath easily.

7.   Help relieve hollow and pinhole problem.

BATH COMPOSITION & OPERATION CONDITION:

Composition

Range

Copper sulfate

160-220 g/l

Sulfuric acid

40-70 g/l

Cl-

60-120 mg/l

FF-210 Make-up

4-6 ml/l

FF-210 A

0.4-1ml/l

FF-210 B

0.2-0.5 ml/l

Temp.

18-40

Cathodic current density

1.5-8 A/dm2

Anodic current density

0.5-3 A/dm2

Anode(phosphorus copper)

0.1-0.3%(P Assay)

Agitation

Air Agitation/Cathode Moving

Voltage

2-10V

 
 
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