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KCR-25
PostTime:2012-5-21 14:20:47    hit:1522
 
KCR-25 HARD CHROMIUM PLATING PROCESS
 

1. The KCR-25 process is a high speed chromium plating process. Its cathode efficiency may be up to 23% ~26%.

2. Higher cathode current density, 60 ASD (ampere per square decimeter) or over, can be applied; it will accept more current before burning will take place.

3. The deposition rate of KCR-25 bath is 2-3 times faster than conventional chromium baths.

4. Unlike other containing fluoride baths, the KCR-25 process dose not cause cathodic low current density etching.

5. The KCR-25 process deposit has a microhardness in the 950 to 1100 KHN100 range.

6. The KCR-25 process deposit is microcracked at greater than 400 cracks per centimeter, so that its corrosion resistance will be improved.

7. The KCR-25 process has better throwing uniformity, its deposit is bright, shine and smoother.

8. No special pretreatments, anodes or plating tanks are required; those used for conventional hard chromium plating baths are usually sufficient for the KCR-25 process.

 

Bath CompositioN & Operating Conditions

Component and Parameter

Range

Chromic acid

200~275 g/L

KCR-25 activator

20ml/L

H2SO4

2.5~4.0 g/l

Temperature

55~60 oC

Cathodic current density

50~75 A/dm2

Anodic current density

15~30 A/dm2

 

 
 
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